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  ? 2002 quicklogic corporation www.quicklogic.com 1 ?      ?      device highlights high performance & high density  9,000 usable pld gates with 82 i/os  300 mhz 16-bit counters, 400 mhz datapaths, 160+ mhz fifos  0.35 m four-layer metal non-volatile cmos process for smallest die sizes high speed embedded sram  8 dual-port ram modules, organized in user-configurable 1,152 bit blocks  5 ns access times, each port independently accessible  fast and efficient for fifo, ram, and rom functions easy to use / fast development cycles  100% routable with 100% utilization and complete pin-out stability  variable-grain logic cells provide high performance and 100% utilization  comprehensive design tools include high quality verilog/vhdl synthesis advanced i/o capabilities  interfaces with both 3.3 v and 5.0 v devices  pci compliant with 3.3 v and 5.0 v busses for -1/-2/-3/-4 speed grades  full jtag boundary scan  i/o cells with individually controlled registered input path and output enables figure 1: quickram block diagram 8 ra m blocks 160 hi gh s pee d logic cells interface ql4009 quickram data sheet 9,000 usable pld gate quickram esp combining performance, density and em bedded ram
2 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b architecture overview the quickram tm family of esps (embedded standard products) offers fpga logic in combination with dual-por t sram modules. the ql4009 is a 9,000 usable pld gate member of the quickram family of esps. quickram esps are fabricated on a 0.35 m four-layer metal process using quicklogic's patented vialink tm technology to provide a unique combination of high performance, high density, low cost, and extreme ease-of-use. the ql4009 contains 160 logic cells and 8 dual port ram modules (see figure 1 ). each ram module has 1,152 ram bits, for a total of 9,216 bits. ram modules are dual port (one read port, one write port) and can be configured into one of four modes: 64 (deep) x18 (wide), 128x9, 256x4, or 512x2 (see figure 4 ). with a maximum of 82 i/os, the ql4009 is available in 68-pin plcc, 84-pi n plcc and 100-pin tqfp packages. designers can cascade multiple ram modules to increase the depth or width allowed in single modules by connecting corresponding address lines together and dividing the words between modules (see figure 2 ). this approach allows up to 512-deep configurations as large as 16 bits wide in the smallest quickram device and 44 bits wide in the largest device. software support for the complete quickram family, including the ql4009, is available through two basic packages. the turnkey quickworks tm package provides the most complete esp software solution from design entry to logic synthesis, to place and route, to simulation. the quicktools tm packages provides a solution for designers who use cadence, exemplar, mentor, synopsys, synplicity, viewlogic, aldec, or other third-party tools for design entry, synthesis, or simulation. the quicklogic variable grain logic cell features up to 16 simultaneous inputs and 5 outputs within a cell that can be fragmented into 5 independent cells. each cell has a fan-in of 29 including register and control lines (see figure 3 ). figure 2: quickram module bits rdata wdata raddr rdata waddr wdata ram module (1,152 bits) ram module (1,152 bits)
? 2002 quicklogic corporation www.quicklogic.com 3       ql4009 quickram data sheet rev b product summary total of 82 i/o pins  74 bi-directional input/output pins, pci- compliant for 5.0 v and 3.3 v buses for -1/-2/-3/-4 speed grades  8 high-drive input/distributed network pins eight low-skew distributed networks  two array clock/control networks available to the logic cell flip-flop clock, set and reset inputs - each driven by an input-only pin  six global clock/control networks available to the logic cell f1, clock, set and reset inputs and the input and i/o register clock, reset and enable inputs as well as the output enable control - each driven by an input-only or i/o pin, or any logic cell output or i/o cell feedback high performance silicon  input + logic cell + output total delays under 6 ns  data path speeds over 400 mhz  counter speeds over 300 mhz  fifo speeds over 160+ mhz
4 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b ac characteristics at v cc = 3.3 v, t a = 25 c (k = 1.00) to calculate delays, multiply the appropriate k factor from table 10: operating range by the following numbers in the tables provided. figure 3: quickram logic cell table 1: logic cell symbol parameter propagation delays (ns) fanout (5) 1 2 3 4 5 t pd combinatorial delay a a. these limits are derived from a representative selection of the slowest paths through the quick- ram logic cell including typical net delays. worst case delay values for specific paths should be determined from timing analysis of your particular design. 1.4 1.7 1.9 2.2 3.2 t su setup time a 1.7 1.7 1.7 1.7 1.7 t h hold time 0.0 0.0 0.0 0.0 0.0 t clk clock to q delay 0.7 1.0 1.2 1.5 2.5 t cwhi clock high time 1.2 1.2 1.2 1.2 1.2 t cwlo clock low time 1.2 1.2 1.2 1.2 1.2 t set set delay 1.0 1.3 1.5 1.8 2.8 t reset reset delay 0.8 1.1 1.3 1.6 2.6 t sw set width 1.9 1.9 1.9 1.9 1.9 t rw reset width 1.8 1.8 1.8 1.8 1.8 qs a1 a2 a3 a4 a5 a6 f1 f2 f3 f4 f5 f6 qs op b1 b2 c1 c2 mp ms d1 d2 e1 e2 np ns qc qr oz az qz nz fz
? 2002 quicklogic corporation www.quicklogic.com 5       ql4009 quickram data sheet rev b figure 4: quickram module table 2: ram cell synchronous write timing symbol parameter propagation delays (ns) fanout 1 2 3 4 5 t swa wa setup time to wclk 1.0 1.0 1.0 1.0 1.0 t hwa wa hold time to wclk 0.0 0.0 0.0 0.0 0.0 t swd wd setup time to wclk 1.0 1.0 1.0 1.0 1.0 t hwd wd hold time to wclk 0.0 0.0 0.0 0.0 0.0 t swe we setup time to wclk 1.0 1.0 1.0 1.0 1.0 t hwe we hold time to wclk 0.0 0.0 0.0 0.0 0.0 t wcrd wclk to rd (wa=ra) a a. stated timing for worst case propagation delay over process variation at v cc = 3.3 v and t a = 25 c. multiply by the appropriate delay factor, k, for speed grade, voltage and temperature settings as specified in the operating range. 5.0 5.3 5.6 5.9 7.1 table 3: ram cell synchronous read timing symbol parameter propagation delays (ns) fanout logic cells 1 2 3 4 5 t sra ra setup time to rclk 1.0 1.0 1.0 1.0 1.0 t hra ra hold time to rclk 0.0 0.0 0.0 0.0 0.0 t sre re setup time to rclk 1.0 1.0 1.0 1.0 1.0 t hre re hold time to rclk 0.0 0.0 0.0 0.0 0.0 t rcrd rclk to rd a a. stated timing for worst case propagation delay over process variation at v cc = 3.3 v and ta = 25 c. multiply by the appropriate delay factor, k, for speed grade, voltage and temperature settings as specified in the operating range. 4.0 4.3 4.6 4.9 6.1 wa wd we wclk re rclk ra rd [8:0] [17:0] [8:0] [17:0] mode asyncrd [1:0]
6 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b table 4: ram cell asynchronous read timing symbol parameter propagation delays (ns) fanout 1 2 3 4 5 rpdrd ra to rd a a. stated timing for worst case propagation delay over process variation at v cc = 3.3 v and ta = 25 c. multiply by the appropriate delay factor, k, for speed grade, voltage and temperature settings as specified in the operating range. 3.0 3.3 3.6 3.9 5.1 table 5: input-only / clock cells symbol parameter propagation delays (ns) fanout 1 2 3 4 8 12 24 t in high drive input delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4 t ini high drive input, inverting delay 1.6 1.7 .19 2.0 2.5 3.0 4.5 t isu input register set-up time 3.1 3.1 3.1 3.1 3.1 3.1 3.1 t ih input register hold time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 t iclk input register clock to q 0.7 0.8 1.0 1.1 1.6 2.1 3.6 t irst input register reset delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5 t iesu input register clock enable setup time 2.3 2.3 2.3 2.3 2.3 2.3 2.3 t ieh input register clock enable hold time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 table 6: clock cells symbol parameter propagation delays (ns) fanout a a. the array distributed networks consist of 40 half columns and the global distributed networks con- sist of 44 half columns, each driven by an independent buffer. the number of half columns used does not affect clock buffer delay. the array clock has up to 8 loads per half column. the global clock has up to 11 loads per half column. 1 2 3 4 8 10 11 t ack array clock delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 t gckp global clock pin delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 t gckb global clock buffer delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3
? 2002 quicklogic corporation www.quicklogic.com 7       ql4009 quickram data sheet rev b table 7: i/o cell input delays symbol parameter propagation delays (ns) fanout a a. stated timing for worst case propagation delay over process variation at v cc = 3.3 v and t a = 25 c. multiply by the appropriate delay factor, k, for speed grade, voltage and temperature settings as specified in the operating range. 1 2 3 4 8 10 t i/o input delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6 t isu input register set-up time 3.1 3.1 3.1 3.1 3.1 3.1 t ih input register hold time 0.0 0.0 0.0 0.0 0.0 0.0 t ioclk input register clock to q 0.7 1.0 1.2 1.5 2.5 3.0 t iorst input register reset delay 0.6 0.9 1.1 1.4 2.4 2.9 t iesu input register clock enable set-up time 2.3 2.3 2.3 2.3 2.3 2.3 t ieh input register clock enable hold time 0.0 0.0 0.0 0.0 0.0 0.0 table 8: i/o cell output delays symbol parameter propagation delays (ns) output load capacitance (pf) 3 50 75 100 150 t outlh output delay low to high 2.1 2.5 3.1 3.6 4.7 t outhl output delay high to low 2.2 2.6 3.2 3.7 4.8 t pzh output delay tri-state to high 1.2 1.7 2.2 2.8 3.9 t pzl output delay tri-state to low 1.6 2.0 2.6 3.1 4.2 t phz output delay high to tri-state a a. the following loads are used for t pxz 2.0 - - - - t plz output delay high to tri-state a 1.2 - - - - 1? 1? tphz tplz 5 pf 5 pf
8 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b dc characteristics the dc specifications are provided in the tables below. table 9: absolute maximum ratings parameter value parameter value v cc voltage -0.5 to 4.6 v dc input current 20 ma v ccio voltag e -0.5 to 7.0 v esd pad protection 2000v input voltage -0.5 v to v ccio +0.5 v storage temperature -65 c to +150 c latch-up immunity 200 ma lead temperature 300 c table 10: operating range symbol parameter military industrial commercial unit min max min max min max v cc supply voltage 3.0 3.6 3.0 3.6 3.0 3.6 v v ccio i/o input tolerance voltage 3.0 5.5 3.0 5.5 3.0 5.25 v t a ambient temperature -55 - -40 85 0 70 c t c case temperature - 125 - - - - c k delay factor -0 speed grade 0.42 2.03 0.43 1.90 0.46 1.85 n/a -1 speed grade 0.42 1.64 0.43 1.54 0.46 1.50 n/a -2 speed grade 0.42 1.37 0.43 1.28 0.46 1.25 n/a -3 speed grade 0.43 0.90 0.46 0.88 n/a -4 speed grade 0.43 0.82 0.46 0.80 n/a
? 2002 quicklogic corporation www.quicklogic.com 9       ql4009 quickram data sheet rev b table 11: dc characteristics symbol parameter conditions min max units v ih input high voltage 0.5v cc v ccio +0.5 v v il input low voltage -0.5 0.3v cc v v oh output high voltage i oh = -12 ma 2.4 v i oh = -500 a 0.9v cc v v ol output low voltage i ol = 16 ma a a. applies only to -1/-2/-3/-4 commercial grade devices. these speed grades are also pci-compliant. all other devices have 8 ma iol specifications. 0.45 v i ol = 1.5 ma 0.1v cc v i i i or i/o input leakage current v i = v ccio or gnd -10 10 a i oz 3-state output leakage current v i = v ccio or gnd -10 10 a c i input capacitance b b. capacitance is sample tested only. clock pins are 12 pf maximum. 10 pf i os output short circuit current c c. only one output at a time. duration should not exceed 30 seconds. v o = gnd -15 -180 ma v o = v cc 40 210 ma i cc d.c. supply current d d. for -1/-2/-3/-4 commercial grade devices only. maximum icc is 3 ma for -0 commercial grade and all industrial grade devices. and 5 ma for all military grade devices. for ac conditions, contact quicklog- ic customer applications group. v i , v io = v ccio or gnd 0.50 (typ) 2 ma i ccio d.c. supply current on v ccio 0 100 a
10 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b kv and kt graphs figure 5: voltage factor vs. supply voltage figure 6: temperature factor vs. operating temperature 0.9200 0.9400 0.9600 0.9800 1.0000 1.0200 1.0400 1.0600 1.0800 1.1000 3 3.1 3.2 3.3 3.4 3.5 3.6 voltage factor vs. supply voltage supply voltage (v) kv 0.85 0.90 0.95 1.00 1.05 1.10 1.15 -60 -40 -20 0 20 40 60 80 temperature factor vs. operating temperature junction temperature c kt
? 2002 quicklogic corporation www.quicklogic.com 11       ql4009 quickram data sheet rev b power-up sequencing figure 7: power-up requirements the following requirements must be met when powering up the device: (refer to figure 7 above)  when ramping up the power supplies keep (v ccio -v cc ) max 500 mv. deviation from this recommendation can cause permanent damage to the device.  v ccio must lead v cc when ramping the device.  the power supply must take greater th an or equal to 400 s to reach v cc . ramping to v cc /v ccio earlier than 400 s can cause th e device to beha ve improperly. an internal diode is present in-between v cc and v ccio , as shown in figure 8 . figure 8: internal diode between v cc and v ccio voltage v ccio v cc (v ccio -v cc ) max time 400 us v cc v cc v ccio internal logic cells, ram blocks, etc io cells
12 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b jtag figure 9: jtag block diagram microprocessors and application specific inte grated circuits (asics) pose many design challenges, not the least of which concerns the accessibility of test points. the joint test access group (jtag) formed in response to this challenge, resulting in ieee standard 1149.1, the standard test access port and boundary scan architecture. the jtag boundary scan test methodology allows complete observation and control of the boundary pins of a jtag-compatible device through jtag software. a test access port (tap) controller works in concert with the instruction register (ir); these allow users to run three required tests, along with several user-defined tests. jtag tests allow users to reduce system debug time, reuse test platforms and tools, and reuse subsystem tests for fuller verification of higher level system elements. tck tms trstb rdi tdo instruction decode & control logic tap controller state machine (16 states) instruction register boundary-scan register (data register) mux bypass register mux internal register i/o registers user defined data register
? 2002 quicklogic corporation www.quicklogic.com 13       ql4009 quickram data sheet rev b the 1149.1 standard requires the following three tests:  extest instruction. the extest instruction performs a pcb interconnect test. this test places a device into an external boundary test mode, selecting the boundary scan register to be connected between the tap's test data in (tdi) and test data out (tdo) pins. boundary scan cells are preloaded with test patterns (via the sample/preload instruction), and input boundary cells capture the input data for analysis.  sample/preload instruction. this instruction allows a device to remain in its functional mode, while selecting the boundary scan register to be connected between the tdi and tdo pins. for this test, the boundary scan register can be accessed via a data scan operation, allowing users to samp le the functional data entering and leaving the device.  bypass instruction. the bypass instruction allows data to skip a device's boundary scan entirely, so the data passes through the bypass register. the bypass instruction allows users to test a device without passing through other devices. the bypass register is connected between the tdi and tdo pins, allowing serial data to be transferred through a device without affecting the operation of the device.
14 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b pin descriptions ordering information table 12: pin descriptions pin function description tdi/rsi test data in for jtag /ram init. serial data in hold high during normal operation. connects to serial prom data in for ram initialization. connect to v cc if unused. trstb/rro active low reset for jtag /ram init. reset out hold low during normal operation. connects to serial prom reset for ram initialization. connect to gnd if unused. tms test mode select for jtag hold high during normal operation. connect to v cc if not used for jtag. tck test clock for jtag hold high or low during normal operation. connect to v cc or ground if not used for jtag. tdo/rco test data out for jtag /ram init. clock out connect to serial prom clock for ram initialization. must be left unconnected if not used for jtag or ram initialization. stm special test mode must be grounded during normal operation. i/aclk high-drive input and/or array network driver can be configured as either or both. i/gclk high-drive input and/or global network driver can be configured as either or both. i high-drive input use for input signals with high fanout. i/o input/output pin can be configured as an input and/or output. v cc power supply pin connect to 3.3 v supply. v ccio input voltage tolerance pin connect to 5.0 v supply if 5 v input tolerance is required, otherwise connect to 3.3 v supply. gnd ground pin connect to ground. gnd/therm ground/thermal pin available on 456-pbga only. connect to ground plane on pcb if heat sinking desired. otherwise may be left unconnected. ql 4009 - 1 pf100 c quicklogic device quickram device part number speed grade 0 = quick 1 = fast 2 = faster 3 = faster *4 = wow operating range c = commercial i = industrial m = military package code pl68 = 68-pin plcc pf84 = 84-pin plcc pf100 = 100-pin tqfp * contact quicklogic regarding availabliity
? 2002 quicklogic corporation www.quicklogic.com 15       ql4009 quickram data sheet rev b 68 plcc pinout diagram figure 10: top view of 68 pin plcc 68 plcc pinout table table 13: 68 plcc pinout table 68 plcc function 68 plcc function 68 plcc function 68 plcc function 1 gnd 18 v cc 35 gnd 52 v cc 2 i/o 19 gclk/i 36 i/o 53 gclk/i 3 i/o 20 gclk/i 37 i/o 54 gclk/i 4 v ccio 21 i/o 38 i/o 55 i/o 5 i/o 22 i/o 39 v ccio 56 i/o 6 i/o 23 i/o 40 i/o 57 i/o 7 i/o 24 i/o 41 i/o 58 i/o 8 i/o 25 i/o 42 trstb 58 i/o 9 tdo 26 i/o 43 tms 60 i/o 10 i/o 27 tdi 44 i/o 61 tck 11 i/o 28 i/o 45 i/o 62 stm 12 i/o 29 i/o 46 i/o 63 i/o 13 i/o 30 i/o 47 i/o 64 i/o 14 gnd 31 i/o 48 gnd 65 i/o 15 i/o 32 i/o 49 i/o 66 i/o 16 gclk/i 33 i/o 50 gclk/i 67 i/o 17 aclk/i 34 i/o 51 aclk/i 68 i/o tdo io io io io vccio io io gnd io io io io io io stm tck io io io io io io gclk/i gclk/i vcc aclk/i gclk/i io gnd io io io io tdi io io io io io io io gnd io io io vccio io io trstb tms 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 QL4009-1PL68C quickram io io io io gnd io gclk/i aclk/i vcc gclk/i gclk/i io io io io io io 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
16 www.quicklogic.com ? 2002 quicklogic corporation       ql4009 quickram data sheet rev b 84 plcc pinout diagram figure 11: top view of 84 pin plcc 84 plcc pinout table table 14: 84 plcc pinout table 84 plcc function 84 plcc function 84 plcc function 84 plcc function 1 i/o 22 aclk/i 43 i/o 64 aclk/i 2 i/o 23 gclk/i 44 i/o 65 gclk/i 3 i/o 24 gclk/i 45 i/o 66 gclk/i 4 v ccio 25 v cc 46 v ccio 67 v cc 5 i/o 26 i/o 47 i/o 68 i/o 6 i/o 27 i/o 48 i/o 69 i/o 7 i/o 28 i/o 49 i/o 70 i/o 8 i/o 29 i/o 50 i/o 71 i/o 9 i/o 30 i/o 51 i/o 72 i/o 10 i/o 31 i/o 52 trstb 73 i/o 11 tdo 32 i/o 53 tms 74 i/o 12 i/o 33 tdi 54 i/o 75 tck 13 i/o 34 i/o 55 i/o 76 stm 14 i/o 35 i/o 56 i/o 77 i/o 15 i/o 36 v cc 57 i/o 78 i/o 16 i/o 37 i/o 58 i/o 79 v cc 17 i/o 38 i/o 59 i/o 80 i/o 18 i/o 39 i/o 60 i/o 81 i/o 19 gnd 40 gnd 61 gnd 82 gnd 20 i/o 41 i/o 62 i/o 83 i/o 21 gclk/i 42 i/o 63 gclk/i 84 i/o tdo io io io io io io vccio io io io io io gnd io io vcc io io stm tck io io io io io io io vcc gclk/i gclk/i aclk/i gclk/i io gnd io io io io io io io tdi io io vcc io io io gnd io io io io io vccio io io io io io trstb tms 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 ql4009-1pl84c quickram io io io io io io io gnd io gclk/i aclk/i gclk/i gclk/i vcc io io io io io io io 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75
? 2002 quicklogic corporation www.quicklogic.com 17       ql4009 quickram data sheet rev b 100 tqfp pinout diagram figure 12: top view of 100 pin tqfp 100 tqfp pinout table table 15: 100 tqfp pinout table 100tqfp function 100tqfp function 100tqfp function 100tqfp function 1 i/o 26 tdi 51 i/o 76 tck 2 i/o 27 i/o 52 i/o 77 stm 3 i/o 28 i/o 53 i/o 78 i/o 4 i/o 29 i/o 54 i/o 79 i/o 5 i/o 30 i/o 55 i/o 80 i/o 6 i/o 31 i/o 56 i/o 81 i/o 7 i/o 32 i/o 57 i/o 82 i/o 8 i/o 33 i/o 58 i/o 83 i/o 9 gnd 34 i/o 59 gnd 84 i/o 10 i/o 35 gnd 60 i/o 85 gnd 11 i 36 i/o 61 i 86 i/o 12 aclk / i 37 i/o 62 aclk / i 87 i/o 13 v cc 38 gnd 63 v cc 88 gnd 14 i 39 i/o 64 i 89 i/o 15 gclk / i 40 i/o 65 gclk / i 90 i/o 16 v cc 41 i/o 66 v cc 91 i/o 17 i/o 42 v ccio 67 i/o 92 v ccio 18 i/o 43 i/o 68 i/o 93 i/o 19 i/o 44 i/o 69 i/o 94 i/o 20 i/o 45 i/o 70 i/o 95 i/o 21 i/o 46 i/o 71 i/o 96 i/o 22 i/o 47 i/o 72 i/o 97 i/o 23 i/o 48 i/o 73 i/o 98 i/o 24 i/o 49 trstb 74 i/o 99 i/o 25 i/o 50 tms 75 i/o 100 tdo pin 1 pin 26 pin 51 pin 76 ql4009-1pf100c quickram
? 2002 quicklogic corporation www.quicklogic.com 18       ql4009 quickram data sheet rev b contact information telephone: 408 990 4000 (us) 416 497 8884 (canada) 44 1932 57 9011 (europe) 49 89 930 86 170 (germany) 852 8106 9091 (asia) 81 45 470 5525 (japan) e-mail: info@quicklogic.com support: support@quicklogic.com web site: http://www.quicklogic.com/ revision history copyright information copyright ? 2002 quicklogic corpor ation. all rights reserved. the information contained in this product brief, and the accompanying software programs are protected by copyright. all rights are rese rved by quicklogic corporation. quicklogic corporation reserves the right to make period ic modifications of this product without obligation to notify any person or entity of such revision. copying, duplicating, selling, or otherwise distributing any part of this product without the prior written consent of an authorized representative of quicklogic is prohibited. quicklogic, pasic, and vialink are regi stered trademarks, and spde and quick works are trademarks of quicklogic corporation. verilog is a registered trademark of cadence design systems, inc. table 16: revision history revision date comments a 5/2000 first release. b 5/2002 added kfactor, power-up, jtag and mechanical drawing information. reformatted.


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